Temperature curve
The temperature curves of a GPU vary significantly between constant load tests and dynamic gaming scenarios. These differences are due to the different load profiles and the use of modern power management technologies. During a stress test, the GPU operates under a constant and consistent load, which results in a stable and relatively even temperature curve. In this scenario, all functional areas of the GPU remain permanently active and mechanisms such as power gating are only used to a limited extent. The constant energy consumption and uniform heat development result in a stable temperature, with cooling operating at a constant performance level. As a result, the thermal capacity of the GPU is optimally utilized without additional stress caused by temperature fluctuations.
In gaming scenarios, on the other hand, the temperature curve shows significant fluctuations caused by the strongly varying performance requirements. Depending on the content and complexity of individual frames, for example when using complex shaders or ray tracing technologies, phases of high and low computing power alternate. Technologies such as power gating help to selectively switch off unused areas of the GPU, which significantly reduces heat generation in phases of low load. At the same time, separate power supplies ensure that critical components, such as the memory, remain continuously supplied regardless of the temporary power reduction of the GPU cores.
Accelerated Frequency Switching, which enables rapid adjustments to clock frequency and voltage, is another key influencing factor. This technology allows the GPU to react to load changes in microseconds and adjust its performance accordingly. This optimizes energy consumption, but at the cost of a more irregular temperature curve. Particularly in scenarios in which the GPU switches between low and high clock frequencies several times within a short period of time, visible temperature fluctuations occur. The heat development follows the dynamic changes in power consumption, which is a challenge for the cooling system as it has to constantly react to the varying thermal conditions. At 58 to 60 °C, the card is low enough in silent mode to achieve high boost steps even without OC.
The memory temperatures of the MSI GeForce RTX 5080 SUPRIM SOC are also pleasingly low.
The cooling of the memory modules is supported by the large vapor chamber and the high-quality thermal pads. In silent mode, the lower fan speeds affect the cooling performance, but this is compensated for by the overall lower waste heat. In Gaming Mode, on the other hand, the fan profile is more aggressive, which controls the higher waste heat from the VRAM. The efficiency of heat dissipation also depends on the quality of the thermal pads used (see material test).
Clock rates
The clock rates of the MSI GeForce RTX 5080 SUPRIM SOC are pleasantly high. Under typical load, the boost clocks range from around 2,805 to 2,812 MHz, depending on the thermal situation and the performance requirements of the game. And yet the average clock rate is more balanced than that of the RTX 5080 VANGUARD.
For comparison: the VANGUARD boosts sporadically with up to 2880 MHz, but it also has the stronger clock drops with the same power target. This is precisely the reason why the SUPRIM is a little bit faster in some games, because the average is what counts.
The increased clock frequency compared to the FE leads to a noticeable increase in performance in graphics-intensive applications, especially at high resolutions such as QHD and 4K.
Thermography
The thermographic images of the MSI GeForce RTX 5080 SUPRIM SOC after 30 minutes each in idle, gaming and torture mode clearly show the thermal distribution and efficiency of the cooling design. The infrared measurements with the Optris PI 640 illustrate how the cooling works under different loads, with both hotspots and temperature ranges with even heat dissipation becoming visible in detail. The thermography shows that the MSI GeForce RTX 5080 SUPRIM SOC has a very efficient cooling design that ensures stable temperatures both under moderate load in gaming and under extreme load in the Torture test.
The board does not exhibit any abnormalities during gaming in silent mode. However, the hotspot is not located where the pad is between the board and the backplate, as this is positioned below the GPU.
It hardly looks any different in the Torture test, although the hotspot is also located differently here:
Backplate and pad problem
Finally, I’ll show you the changed position of the pad, which covers the real hotspot on the back of the board. Unfortunately, MSI had glued the pad further to the left directly under the GPU, i.e. in the wrong place because it was not optimal. But this can be changed and probably will be. I have already done it once for myself:
- 1 - Einführung, übersicht und technische Daten
- 2 - Testsystem und Equipment
- 3 - Teardown: Platine und Kühler
- 4 - Materialanalyse und Wärmeleitmaterialien
- 5 - Gaming Performance
- 6 - Leistungsaufnahme, Lastspitzen, Netzteilempfehlung
- 7 - Temperaturen, Taktraten und Thermografie
- 8 - Lüfterkurven und Betriebsgeräusch
- 9 - Zusammenfassung und Fazit
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