Teardown and PCB analysis
The teardown is relatively easy to carry out. Once the modules have warmed up, the heat sinks can be removed relatively easily. Only at the corners was the foam layer sometimes weaker than the adhesive.
Only about 3/4 of the ICs are in contact with the “thermal pad”, although this is probably almost irrelevant. Instead, the PMIC has been given a very soft, pink pad which, according to the impression picture, can make good contact with the components of different heights. However, the pad is a little on the oily side and the board remains somewhat greasy.
On the back, there is only the foam pad for the ICs. The heat sink halves are glued with double-sided tape to the black plastic element that holds them in place above the board.
The cooler halves themselves each consist of two aluminum layers with a thickness of approx. 0.7 mm. Depending on the side, either 1.2 mm or 1.7 mm foam is placed on top for the ICs. The pink thermal pad of the PMIC is probably 2.0 mm thick, but is difficult to measure due to its softness.
One module weighs a total of 49 g, of which the heat sink components account for 33 g.
If we now take a closer look at the board, the first thing we notice is that the ICs are not labeled. Only a “partial” or batch number is engraved on the bottom edge. The font at least suggests SK Hynix, which is also confirmed by the SPD entry, and the character string is similar to that on Hynix 16 Gbit A-Die ICs (xxAG, thanks Watermelonn for the hint). But what the official die designation is remains unclear.
According to the SPD information, the PMIC and SPD should come from IDT. In fact, the chip labeled SY5888 2511A7 SV961B is a SY5888 from Shenzhen Think Future Semiconductor. The SPD EEPROM chip bears the numbers 510 1A0 542 and cannot be assigned more precisely. The values from the SPD are only as good as the person who programmed them in, and there was obviously some sloppiness here. After all, VDD/VDDQ > 1.435 V can actually be supplied by the PMIC, even if the chip manufacturer is incorrect. Other information, such as the “H-Die” IC revision, is becoming increasingly dubious.
The board itself bears various small markings. First of all, the manufacturer Dynamic Electronics, which also produces the circuit boards for Crucial DDR5 kits, has immortalized itself in one corner. In addition to the usual identifiers for safety certifications, we also find the production week 2519. In the opposite corner, a field has been left blank in the top PCB layer, which serves as a net for shielding. The number sequence 4124540 is printed here.
On the back, there is another screen-printed character sequence RT85URCB0-10-3, which is probably the design revision of the PCB. Unfortunately, there is no layer indicator.
After a few minutes of grinding, the 8 layers are revealed – effectively standard for DDR5 UDIMMs.
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