Putty Details

Product Images

General Information

Manufacturer

Halnziye

Designation

HY 268

Manufacturer Specifications

Bulk Thermal Conductivity λ

8

Accessories

Nothing

Container

Can

Container

Can

Notes and Recommendations

Usability

Conclusion

Very sticky and average thermal conductivity. The application, removal and cleaning is a pain. Not recommended in any case.

Measurements

Thermal Conductivity (W/m·K)

4.7

Min BLT

10

Interface Resistance

22.8

Heat Conducting Particles and Matrix

Al2O3, ZnO, Silicone

Particle Size

<15 µm

Material Testing and TIMA Protocol (on request)

Microscopy and Particles

Measurement Process

Thermal Resistances R_th

Thermal resistance R_th correlates linearly with layer thickness, unlike thermal conductivity, which follows a non-linear curve. Layer thicknesses below 1000 µm are typically relevant for memory, whereas VRM applications may range from 1500 µm to 3000 µm depending on the heatsink design.

I have compiled a bar chart comparing relevant layer thicknesses from 250 to 3000 µm for R_th.

Minimum Possible Layer Thickness

This is exactly why I wanted to find out how far one can go with a bit of pressure and how much a putty can still be compressed. Here, I use the usual 9N pro cm², which is more than sufficient and exceeds the pressure typically achieved by, for example, a GPU cooler.

Effective Thermal Conductivity and Cooling Simulation

If R_th is already available, one wouldn't actually need λ_eff, the effective thermal conductivity. We can also observe how the values change across the BLT, although one cannot expect a linear curve due to the included area and BLT.

I have again illustrated the relevant layer thicknesses from 250 to 3000 µm as a bar chart for λ_eff for comparison.