Paste Laird Tputty 607
Product Images
General Information
Manufacturer Specifications
Notes and Recommendations
Measurements
Material Testing and TIMA Protocol (on request)
Microscopy and Particles
Measurement Process
Thermal Resistances Rth
Thermal resistance Rth correlates linearly with layer thickness, unlike thermal conductivity, which follows a non-linear curve. Layer thicknesses below 1000 µm are typically relevant for memory, whereas VRM applications may range from 1500 µm to 3000 µm depending on the heatsink design.
I have compiled a bar chart comparing relevant layer thicknesses from 250 to 3000 µm for Rth.
Minimum Possible Layer Thickness
This is exactly why I wanted to find out how far one can go with a bit of pressure and how much a putty can still be compressed. Here, I use the usual 9N pro cm², which is more than sufficient and exceeds the pressure typically achieved by, for example, a GPU cooler.
Effective Thermal Conductivity and Cooling Simulation
If Rth is already available, one wouldn't actually need λeff, the effective thermal conductivity. We can also observe how the values change across the BLT, although one cannot expect a linear curve due to the included area and BLT.
I have again illustrated the relevant layer thicknesses from 250 to 3000 µm as a bar chart for λeff for comparison.
DRAM Simulation
VRM Simulation
