Putty Details

Product Images

General Information

Manufacturer

LiPoly

Designation

SH-Putty 3

Manufacturer Specifications

Bulk Thermal Conductivity λ

8

Density

3.4 g/cm³

Manufacturer Viscosity

17000 Pa.s

Breakdown Voltage

12 KV/mm

Thermal Impedance

0.031 °C-in²/ W

Max Pressure

50 PSI

Accessories

Nothing

Container

Can

Container

Can

Notes and Recommendations

Usability

Conclusion

Dry putty with only mediocre thermal performace, but easy to apply and to remove.

Measurements

Thermal Conductivity (W/m·K)

6.0

Min BLT

43

Interface Resistance

70.6

Heat Conducting Particles and Matrix

Al2O3, Silicone

Particle Size

<= 5 µm

Material Testing and TIMA Protocol (on request)

Microscopy and Particles

Measurement Process

Thermal Resistances R_th

Thermal resistance R_th correlates linearly with layer thickness, unlike thermal conductivity, which follows a non-linear curve. Layer thicknesses below 1000 µm are typically relevant for memory, whereas VRM applications may range from 1500 µm to 3000 µm depending on the heatsink design.

I have compiled a bar chart comparing relevant layer thicknesses from 250 to 3000 µm for R_th.

Minimum Possible Layer Thickness

This is exactly why I wanted to find out how far one can go with a bit of pressure and how much a putty can still be compressed. Here, I use the usual 9N pro cm², which is more than sufficient and exceeds the pressure typically achieved by, for example, a GPU cooler.

Effective Thermal Conductivity and Cooling Simulation

If R_th is already available, one wouldn't actually need λ_eff, the effective thermal conductivity. We can also observe how the values change across the BLT, although one cannot expect a linear curve due to the included area and BLT.

I have again illustrated the relevant layer thicknesses from 250 to 3000 µm as a bar chart for λ_eff for comparison.